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| M Features * * * * * * * * Single-Supply: 2.7V to 5.5V Rail-to-Rail Output Input Range Includes Ground Gain Bandwidth Product: 2.8 MHz (typ.) Unity-Gain Stable Low Quiescent Current: 230 A/amplifier (typ.) Chip Select (CS): MCP603 only Temperature Ranges: - Industrial: -40C to +85C - Extended: -40C to +125C * Available in Single, Dual and Quad MCP601/2/3/4 Description The Microchip Technology Inc. MCP601/2/3/4 family of low-power operational amplifiers (op amps) are offered in single (MCP601), single with Chip Select (CS) (MCP603), dual (MCP602) and quad (MCP604) configurations. These op amps utilize an advanced CMOS technology that provides low bias current, highspeed operation, high open-loop gain and rail-to-rail output swing. This product offering operates with a single supply voltage that can be as low as 2.7V, while drawing 230 A (typ.) of quiescent current per amplifier. In addition, the common mode input voltage range goes 0.3V below ground, making these amplifiers ideal for single-supply operation. These devices are appropriate for low-power, batteryoperated circuits due to the low quiescent current, for A/D convert driver amplifiers because of their wide bandwidth or for anti-aliasing filters by virtue of their low input bias current. The MCP601, MCP602 and MCP603 are available in standard 8-lead PDIP, SOIC and TSSOP packages. The MCP601 and MCP601R are also available in a standard 5-lead SOT-23 package, while the MCP603 is available in a standard 6-lead SOT-23 package. The MCP604 is offered in standard 14-lead PDIP, SOIC and TSSOP packages. The MCP601/2/3/4 family is available in the Industrial and Extended temperature ranges and has a power supply range of 2.7V to 5.5V. 2.7V to 5.5V Single-Supply CMOS Op Amps Typical Applications * * * * * * * Portable Equipment A/D Converter Driver Photo Diode Pre-amp Analog Filters Data Acquisition Notebooks and PDAs Sensor Interface Available Tools * SPICE Macro Models at www.microchip.com * FilterLab(R) Software at www.microchip.com Package Types MCP601 PDIP, SOIC, TSSOP NC 1 VIN- 2 VIN+ 3 VSS 4 8 NC 7 VDD 6 VOUT 5 NC MCP602 PDIP, SOIC, TSSOP VOUTA 1 VINA- 2 VINA+ 3 VSS 4 8 VDD 7 VOUTB 6 VINB- 5 VINB+ MCP603 PDIP, SOIC, TSSOP NC 1 VIN- 2 VIN + 3 VSS 4 8 CS 7 VDD 6 VOUT 5 NC MCP604 PDIP, SOIC, TSSOP VOUTA 1 VINA- 2 VINA+ 3 VDD 4 VINB+ 5 VINB- 6 VOUTB 7 14 VOUTD 13 VIND- 12 VIND+ 11 VSS 10 VINC+ 9 VINC- 8 VOUTC MCP601 SOT23-5 VOUT 1 VSS 2 VIN+ 3 4 VIN- 5 VDD VOUT 1 VDD 2 VIN+ 3 MCP601R SOT23-5 5 VSS 4 VIN- VOUT 1 VSS 2 VIN + 3 MCP603 SOT23-6 6 VDD 5 CS 4 VIN- 2004 Microchip Technology Inc. DS21314F-page 1 MCP601/2/3/4 1.0 ELECTRICAL CHARACTERISTICS PIN FUNCTION TABLE Name VIN +, VINA+, VINB+, VINC+, VIND+ VIN -, VINA-, VINB-, VINC-, VIND- VDD VSS VOUT, VOUTA, VOUTB, VOUTC , VOUTD CS NC Function Non-inverting Inputs Inverting Inputs Positive Power Supply Negative Power Supply Outputs Chip Select No Internal Connection Absolute Maximum Ratings VDD - VSS .........................................................................7.0V All inputs and outputs...................... VSS - 0.3V to VDD + 0.3V Difference Input voltage ........................................ |VDD - VSS| Output Short Circuit Current...................................continuous Current at Input Pin .......................................................2 mA Current at Output and Supply Pins .............................30 mA Storage temperature .....................................-65C to +150C Junction temperature .................................................. +150C ESD protection on all pins (HBM; MM) ................ 3 kV; 200V Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Electrical Specifications: Unless otherwise specified, TA = +25C, VDD = +2.7V to +5.5V, VSS = GND, VCM = VDD/2, VOUT VDD /2 and RL = 100 k to VDD /2. Parameters Input Offset Input Offset Voltage Industrial Temperature Extended Temperature Input Offset Temperature Drift Power Supply Rejection Input Current and Impedance Input Bias Current Industrial Temperature Extended Temperature Input Offset Current Common Mode Input Impedance Differential Input Impedance Common Mode Common Mode Input Range Common Mode Rejection Ratio Open-loop Gain DC Open-loop Gain (large signal) Sym VOS VOS VOS VOS/TA PSRR IB IB IB IOS ZCM ZDIFF VCMR CMRR A OL AOL Output Maximum Output Voltage Swing Linear Output Voltage Swing Output Short Circuit Current Min -2 -3 -4.5 -- 80 -- -- -- -- -- -- VSS - 0.3 75 100 95 Typ 0.7 1 1 2.5 88 1 20 450 1 1013||6 1013||3 -- 90 115 110 Max +2 +3 +4.5 -- -- -- 60 5000 -- -- -- VDD - 1.2 -- -- -- Units mV mV mV V/C dB Conditions TA = -40C to +85C (Note 1) TA = -40C to +125C (Note 1) TA = -40C to +125C VDD = 2.7V to 5.5V pA pA TA = +85C (Note 1) pA TA = +125C (Note 1) pA ||pF ||pF V dB dB dB VDD = 5.0V, VCM = -0.3V to 3.8V RL = 25 k to VDD/2, VOUT = 100 mV to VDD - 100 mV RL = 5 k to VDD/2, VOUT = 100 mV to VDD - 100 mV RL = 25 k to VDD /2, Output overdrive = 0.5V RL = 5 k to VDD/2, Output overdrive = 0.5V RL = 25 k to VDD/2, AOL 100 dB RL = 5 k to VDD/2, AOL 95 dB VDD = 5.5V VDD = 2.7V VOL, VOH VSS + 15 VOL, VOH VSS + 45 VOUT VSS + 100 VOUT VSS + 100 ISC -- ISC -- -- -- -- -- 22 12 VDD - 20 VDD - 60 V DD - 100 V DD - 100 -- -- mV mV mV mV mA mA Power Supply Supply Voltage VDD 2.7 -- 5.5 V Quiescent Current per Amplifier IQ -- 230 325 A IO = 0 Note 1: These specifications are not tested in either the SOT-23 or TSSOP packages with date codes older than YYWW = 0408. In these cases, the minimum and maximum values are by design and characterization only. DS21314F-page 2 2004 Microchip Technology Inc. MCP601/2/3/4 AC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, TA = +25C, VDD = +2.7V to +5.5V, VSS = GND, V CM = VDD/2, VOUT VDD /2, RL = 100 k to VDD/2 and CL = 50 pF. Parameters Frequency Response Gain Bandwidth Product Phase Margin Step Response Slew Rate Settling Time (0.01%) Noise Input Noise Voltage Input Noise Voltage Density Input Noise Current Density Eni eni eni ini -- -- -- -- 7 29 21 0.6 -- -- -- -- VP-P f = 0.1 Hz to 10 Hz nV/Hz f = 1 kHz nV/Hz f = 10 kHz fA/Hz f = 1 kHz SR tsettle -- -- 2.3 4.5 -- -- V/s s G = +1 V/V G = +1 V/V, 3.8V step GBWP PM -- -- 2.8 50 -- -- MHz G = +1 V/V Sym Min Typ Max Units Conditions MCP603 CHIP SELECT CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, TA = +25C, VDD = +2.7V to +5.5V, VSS = GND, V CM = VDD/2, VOUT VDD /2, RL = 100 k to VDD/2 and CL = 50 pF. Parameters DC Characteristics CS Logic Threshold, Low CS Input Current, Low CS Logic Threshold, High CS Input Current, High Shutdown V SS current Amplifier Output Leakage in Shutdown CS Threshold Hysteresis Timing CS Low to Amplifier Output Turn-on Time CS High to Amplifier Output High-Z Time tON tOFF -- -- 3.1 100 10 -- s ns CS 0.2VDD , G = +1 V/V CS 0.8VDD , G = +1 V/V, No load. VIL ICSL VIH ICSH IQ_SHDN IO_SHDN HYST VSS -1.0 0.8 VDD -- -2.0 -- -- -- -- -- 0.7 -0.7 1 0.3 0.2 VDD -- VDD 2.0 -- -- -- V A V A A nA V Internal switch CS = VDD CS = VDD CS = 0.2VDD Sym Min Typ Max Units Conditions CS tON VOUT IDD ISS CS Current Hi-Z 2 nA (typ.) -700 nA (typ.) tOFF Output Active 230 A (typ.) -230 A (typ.) 2 nA (typ.) Hi-Z 700 nA (typ.) FIGURE 1-1: Timing Diagram. MCP603 Chip Select (CS) 2004 Microchip Technology Inc. DS21314F-page 3 MCP601/2/3/4 TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = +2.7V to +5.5V and VSS = GND. Parameters Temperature Ranges Specified Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 5L-SOT23 Thermal Resistance, 6L-SOT23 Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC Thermal Resistance, 8L-TSSOP Thermal Resistance, 14L-PDIP Thermal Resistance, 14L-SOIC Thermal Resistance, 14L-TSSOP Note: JA JA JA JA JA JA JA JA -- -- -- -- -- -- -- -- 256 230 85 163 124 70 120 100 -- -- -- -- -- -- -- -- C/W C/W C/W C/W C/W C/W C/W C/W TA TA TA TA -40 -40 -40 -65 -- -- -- -- +85 +125 +125 +150 C C C C Industrial temperature parts Extended temperature parts Note Sym Min Typ Max Units Conditions The Industrial temperature parts operate over this extended range, but with reduced performance. The Extended temperature specs do not apply to Industrial temperature parts. In any case, the internal Junction temperature (TJ) must not exceed the absolute maximum specification of 150C. DS21314F-page 4 2004 Microchip Technology Inc. MCP601/2/3/4 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, TA = +25C, VDD = +2.7V to +5.5V, VSS = GND, VCM = VDD/2, RL = 100 k to VDD/2, V OUT VDD/2 and CL = 50 pF. 120 Open-Loop Gain (dB) 100 80 60 40 20 0 -20 -40 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 0 Quiescent Current per Amplifier (A) Open-Loop Phase () Gain Phase -30 -60 -90 -120 -150 -180 -210 0.1 1 10 100 1k 10k 100k 1M 10M -240 300 250 200 150 100 50 0 IO = 0 -40C +25C +85C +125C 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Supply Voltage (V) Frequency (Hz) FIGURE 2-1: Frequency. 3.5 3.0 Slew Rate (V/s) 2.5 2.0 1.5 1.0 0.5 0.0 -50 -25 0 Open-Loop Gain, Phase vs. FIGURE 2-4: Supply Voltage. 300 Quiescent Current per Amplifier (A) 250 200 150 100 50 0 Quiescent Current vs. VDD = 5.0V Falling Edge IO = 0 VDD = 5.5V Rising Edge VDD = 2.7V 25 50 75 100 125 -50 -25 0 25 50 75 100 125 Ambient Temperature (C) Ambient Temperature (C) FIGURE 2-2: Slew Rate vs. Temperature. FIGURE 2-5: Temperature. 10 Input Noise Voltage Density (V/Hz) 10,000 Quiescent Current vs. 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -50 GBWP PM, G = +1 -25 0 25 50 75 110 100 90 80 70 60 50 40 30 20 10 0 100 125 Gain Bandwidth Product (MHz) Phase Margin, G = +1 () 1 1,000 100n 100 10n 0.1 10 1.E-01 1.E+00 1 10 1.E+01 100 1.E+02 1k 1.E+03 10k 1.E+04 100k 1.E+05 1M 1.E+06 Ambient Temperature (C) Frequency (Hz) FIGURE 2-3: Gain Bandwidth Product, Phase Margin vs. Temperature. FIGURE 2-6: vs. Frequency. Input Noise Voltage Density 2004 Microchip Technology Inc. DS21314F-page 5 MCP601/2/3/4 Note: Unless otherwise indicated, TA = +25C, VDD = +2.7V to +5.5V, VSS = GND, VCM = VDD/2, RL = 100 k to VDD/2, V OUT VDD/2 and CL = 50 pF. 16% Percentage of Occurrences 14% 12% 10% 8% 6% 4% 2% 0% -2.0 -1.6 -1.2 -0.8 -0.4 0.0 0.4 0.8 1.2 1.6 2.0 Input Offset Voltage (mV) 18% Percentage of Occurrences 1200 Samples 16% 14% 12% 10% 8% 6% 4% 2% 0% -10 -8 -6 -4 -2 0 2 4 6 8 10 Input Offset Voltage Drift (V/C) 1200 Samples TA = -40 to +125C FIGURE 2-7: 0.5 0.4 0.3 0.2 0.1 0.0 -0.1 -0.2 -0.3 -0.4 -0.5 -50 -25 Input Offset Voltage. FIGURE 2-10: 100 CMRR, PSRR (dB) Input Offset Voltage Drift. Input Offset Voltage (mV) VDD = 5.5V 95 90 85 80 75 PSRR CMRR VDD = 2.7V 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 Ambient Temperature (C) Ambient Temperature (C) FIGURE 2-8: Temperature. Input Offset Voltage vs. FIGURE 2-11: Temperature. 800 700 600 500 400 300 200 100 0 -100 -200 CMRR, PSRR vs. 1.5 2.0 Common Mode Input Voltage (V) -0.5 800 700 VDD = 2.7V TA = -40C 600 TA = +25C 500 TA = +85C 400 TA = +125C 300 200 100 0 TA = +125C -100 -200 -0.5 0.0 0.5 1.0 Input Offset Voltage (V) Input Offset Voltage (V) VDD = 5.5V TA = -40C TA = +25C TA = +85C TA = +125C TA = +125C 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 Common Mode Input Voltage (V) FIGURE 2-9: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 2.7V. FIGURE 2-12: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 5.5V. DS21314F-page 6 2004 Microchip Technology Inc. 5.0 MCP601/2/3/4 Note: Unless otherwise indicated, TA = +25C, VDD = +2.7V to +5.5V, VSS = GND, VCM = VDD/2, RL = 100 k to VDD/2, V OUT VDD/2 and CL = 50 pF. Channel to Channel Separation (dB) 150 140 130 120 110 100 90 1.E+03 1.E+04 1.E+05 1.E+06 No Load CMRR, PSRR (dB) 100 90 80 70 60 50 40 30 20 VDD = 5.0V 10 100 1.E+00 1.E+01 PSRR+ PSRRCMRR 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1k 10k 100k Frequency (Hz) 1M 1k 10k Frequency (Hz) 100k FIGURE 2-13: Channel-to-Channel Separation vs. Frequency. Input Bias and Offset Currents (pA) 1000 FIGURE 2-16: Frequency. Input Bias and Offset Currents (pA) 1000 CMRR, PSRR vs. VDD = 5.5V VCM = 4.3V IB, +125C 100 VDD = 5.5V max. VCMR 4.3V 100 IB 10 IOS IB, +85C 10 IOS, +125C IOS, +85C 1 25 35 45 55 65 75 85 95 105 115 125 Ambient Temperature (C) 1 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Common Mode Input Voltage (V) FIGURE 2-14: Input Bias Current, Input Offset Current vs. Ambient Temperature. 120 DC Open-Loop Gain (dB) FIGURE 2-17: Input Bias Current, Input Offset Current vs. Common Mode Input Voltage. 120 DC Open-Loop Gain (dB) RL = 25 k 110 100 90 80 110 VDD = 5.5V 100 VDD = 2.7V 90 80 100 1.E+02 1.E+03 1.E+04 1.E+05 1k 10k Load Resistance () 100k 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Supply Voltage (V) FIGURE 2-15: Load Resistance. DC Open-Loop Gain vs. FIGURE 2-18: Supply Voltage. DC Open-Loop Gain vs. 2004 Microchip Technology Inc. DS21314F-page 7 MCP601/2/3/4 Note: Unless otherwise indicated, TA = +25C, VDD = +2.7V to +5.5V, VSS = GND, VCM = VDD/2, RL = 100 k to VDD/2, V OUT VDD/2 and CL = 50 pF. 3.5 Gain Bandwidth Product (MHz) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 100 1.E+02 1.E+03 1.E+04 1.E+05 90 GBWP 80 70 60 PM, G = +1 50 40 1k 10k Load Resistance () 30 100k Phase Margin, G = +1 () DC Open-Loop Gain (dB) VDD = 5.0V 100 130 VDD = 5.5V, RL = 25 k 120 110 100 90 80 -50 -25 0 25 50 75 100 125 Ambient Temperature (C) VDD = 5.5V, RL = 5 k VDD = 2.7V, RL = 25 k VDD = 2.7V, RL = 5 k FIGURE 2-19: Gain Bandwidth Product, Phase Margin vs. Load Resistance. 1,000 Output Headroom (mV); VDD - VOH and VOL - VSS FIGURE 2-22: Temperature. 1000 Output Headroom (mV); VDD - VOH and VOL - VSS DC Open-Loop Gain vs. VDD = 5.5V RL tied to VDD/2 VDD - VOH, RL = 5 k VOL - VSS, RL = 5 k 100 100 VDD-VOH VOL-VSS 10 10 VDD - VOH, RL = 25 k VOL - VSS, RL = 25 k 1 -50 -25 0 25 50 75 100 125 1 0.01 0.1 1 Output Current Magnitude (mA) 10 Ambient Temperature (C) FIGURE 2-20: Output Voltage Headroom vs. Output Current. 10 Maximum Output Voltage Swing (VP-P) FIGURE 2-23: vs. Temperature. 30 25 20 15 10 5 0 Output Voltage Headroom Output Short Circuit Current Magnitude (mA) VDD = 5.0V TA = -40C TA = +25C TA = +85C TA = +125C 1 0.1 10k 1.E+04 1.E+05 1.E+06 1.E+07 100k 1M 10M 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Supply Voltage (V) Frequency (Hz) FIGURE 2-21: Maximum Output Voltage Swing vs. Frequency. FIGURE 2-24: Output Short-Circuit Current vs. Supply Voltage. DS21314F-page 8 2004 Microchip Technology Inc. MCP601/2/3/4 Note: Unless otherwise indicated, TA = +25C, VDD = +2.7V to +5.5V, VSS = GND, VCM = VDD/2, RL = 100 k to VDD/2, V OUT VDD/2 and CL = 50 pF. 5.0 4.5 Output Voltage (V) 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.E+00 1.E-06 2.E-06 3.E-06 4.E-06 5.E-06 6.E-06 7.E-06 8.E-06 9.E-06 1.E-05 VDD = 5.0V G = +1 Output Voltage (V) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.E+00 1.E-06 2.E-06 3.E-06 VDD = 5.0V G = -1 4.E-06 5.E-06 6.E-06 7.E-06 8.E-06 9.E-06 1.E-05 Time (1 s/div) Time (1 s/div) FIGURE 2-25: Pulse Response. 2.59 Large Signal Non-Inverting FIGURE 2-28: Response. 2.59 Large Signal Inverting Pulse Output Voltage (20 mV/div) Output Voltage (20 mV/div) 2.57 VDD = 5.0V G = +1 2.57 VDD = 5.0V G = -1 2.55 2.55 2.53 2.53 2.51 2.51 2.49 2.49 2.47 2.47 2.45 2.45 2.43 2.43 2.41 0.E+00 1.E-06 2.E-06 3.E-06 4.E-06 5.E-06 6.E-06 7.E-06 8.E-06 9.E-06 1.E-05 2.41 0.E+00 1.E-06 2.E-06 3.E-06 4.E-06 5.E-06 6.E-06 7.E-06 8.E-06 9.E-06 1.E-05 Time (1 s/div) Time (1 s/div) FIGURE 2-26: Pulse Response. 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -0.5 Small Signal Non-Inverting FIGURE 2-29: Response. 0 Small Signal Inverting Pulse CS VDD = 5.0V G = +1 VIN = 2.5V RL = 100 k to GND VOUT Active -100 Quiescent Current through VSS (A) -200 -300 -400 -500 -600 -700 VOUT High-Z VDD = 5.5V Output Voltage, Chip Select Voltage (V) -800 5.0E-05 0.0E+00 5.0E-06 1.0E-05 1.5E-05 2.0E-05 2.5E-05 3.0E-05 3.5E-05 4.0E-05 4.5E-05 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Chip Select Voltage (V) Time (5 s/div) FIGURE 2-27: (MCP603). Chip Select Timing FIGURE 2-30: Quiescent Current Through VSS vs. Chip Select Voltage (MCP603). 2004 Microchip Technology Inc. DS21314F-page 9 MCP601/2/3/4 Note: Unless otherwise indicated, TA = +25C, VDD = +2.7V to +5.5V, VSS = GND, VCM = VDD/2, RL = 100 k to VDD/2, V OUT VDD/2 and CL = 50 pF. 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Chip Select Voltage (V) VDD = 5.5V 6 5 4 3 2 1 0 -1 0.0E+00 5.0E-06 1.0E-05 1.5E-05 2.0E-05 2.5E-05 Chip Select Pin Current (A) (Input and Output Voltages (V) VDD = +5.0V G = +2 VIN VOUT Time (5 s/div) FIGURE 2-31: Chip Select Pin Input Current vs. Chip Select Voltage. 3.0 2.5 2.0 1.5 1.0 0.5 0.0 Amplifier Hi-Z 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Chip Select Voltage (V) CS Hi to Low CS Low to Hi Amplifier On FIGURE 2-33: The MCP601/2/3/4 family of op amps shows no phase reversal under input overdrive. Internal Chip Select Switch Output Voltage (V) VDD = 5.0V FIGURE 2-32: Internal Switch. Hysteresis of Chip Select's DS21314F-page 10 2004 Microchip Technology Inc. MCP601/2/3/4 3.0 APPLICATIONS INFORMATION The MCP601/2/3/4 family of op amps are fabricated on Microchip's state-of-the-art CMOS process. They are unity-gain stable and suitable for a wide range of general purpose applications. The second specification that describes the output swing capability of these amplifiers is the Linear Output Voltage Swing. This specification defines the maximum output swing that can be achieved while the amplifier is still operating in its linear region. To verify linear operation in this range, the large signal (DC Open-Loop Gain (AOL)) is measured at points 100 mV inside the supply rails. The measurement must exceed the specified gains in the specification table. 3.1 Input The MCP601/2/3/4 amplifier family is designed to not exhibit phase reversal when the input pins exceed the supply rails. Figure 2-33 shows an input voltage that exceeds both supplies with no resulting phase inversion. The Common Mode Input Voltage Range (VCMR) includes ground in single-supply systems (VSS), but does not include VDD. This means that the amplifier input behaves linearly as long as the Common Mode Input Voltage (VCM) is kept within the specified VCMR limits (V SS - 0.3V to VDD - 1.2V at +25C). Input voltages that exceed the input voltage range (VSS - 0.3V to VDD - 1.2V at +25C) can cause excessive current to flow into or out of the input pins. Current beyond 2 mA may cause reliability problems. Applications that exceed this rating must externally limit the input current with a resistor (R IN), as shown in Figure 3-1. RIN VIN + 3.3 MCP603 Chip Select (CS) The MCP603 is a single amplifier with Chip Select (CS). When CS is pulled high, the supply current drops to -0.7 A (typ.), which is pulled through the CS pin to VSS. When this happens, the amplifier output is put into a high-impedance state. Pulling CS low enables the amplifier and, if the CS pin is left floating, the amplifier may not operate properly. Figure 1-1 is the Chip Select timing diagram and shows the output voltage, supply currents and CS current in response to a CS pulse. Figure 2-27 shows the measured output voltage response to a CS pulse. 3.4 Capacitive Loads MCP60X - Driving large capacitive loads can cause stability problems for voltage feedback op amps. As the load capacitance increases, the feedback loop's phase margin decreases and the closed-loop bandwidth is reduced. This produces gain peaking in the frequency response with overshoot and ringing in the step response. When driving large capacitive loads with these op amps (e.g., > 40 pF when G = +1), a small series resistor at the output (RISO in Figure 3-2) improves the feedback loop's phase margin (stability) by making the output load resistive at higher frequencies. The bandwidth will be generally lower than the bandwidth with no capacitive load. RISO VOUT CL ( maximum expected V IN ) - V DD R IN ----------------------------------------------------------------------------2 mA V SS - ( minimum expected V IN ) R IN -------------------------------------------------------------------------2 mA FIGURE 3-1: into an input pin. R IN limits the current flow RG + MCP60X - RF 3.2 Rail-to-Rail Output There are two specifications that describe the output swing capability of the MCP601/2/3/4 family of op amps. The first specification (Maximum Output Voltage Swing) defines the absolute maximum swing that can be achieved under the specified load conditions. For instance, the output voltage swings to within 15 mV of the negative rail with a 25 k load to VDD/2. Figure 2-33 shows how the output voltage is limited when the input goes beyond the linear region of operation. FIGURE 3-2: Output resistor RISO stabilizes large capacitive loads. Figure 3-3 gives recommended RISO values for different capacitive loads and gains. The x-axis is the normalized load capacitance (CL/GN) in order to make it easier to interpret the plot for arbitrary gains. GN is the circuit's noise gain. For non-inverting gains, GN and the gain are equal. For inverting gains, GN = 1 + |Gain| (e.g., -1 V/V gives G N = +2 V/V). 2004 Microchip Technology Inc. DS21314F-page 11 MCP601/2/3/4 1. 1k Recommended RISO ( ) 1,000 2. 100 100 GN = +1 GN +2 Connect the guard ring to the inverting input pin (VIN-) for non-inverting gain amplifiers, including unity-gain buffers. This biases the guard ring to the common mode input voltage. Connect the guard ring to the non-inverting input pin (VIN+) for inverting gain amplifiers and transimpedance amplifiers (converts current to voltage, such as photo detectors). This biases the guard ring to the same reference voltage as the op amp (e.g., VDD/2 or ground). 10 10p 10 10 100 1,000 10,000 100p 1n 10n Normalized Load Capacitance; CL / GN (F) 3.7 3.7.1 Typical Applications ANALOG FILTERS FIGURE 3-3: Recommended RISO values for capacitive loads. Once you've selected RISO for your circuit, doublecheck the resulting frequency response peaking and step response overshoot in your circuit. Evaluation on the bench and simulations with the MCP601/2/3/4 SPICE macro model are very helpful. Modify R ISO's value until the response is reasonable. Figure 3-5 and Figure 3-6 show low-pass, secondorder, Butterworth filters with a cutoff frequency of 10 Hz. The filter in Figure 3-5 has a non-inverting gain of +1 V/V, and the filter in Figure 3-6 has an inverting gain of -1 V/V. G = +1 V/V fP = 10 Hz 3.5 Supply Bypass C1 47 nF R2 R1 641 k 382 k VIN C2 22 nF With this family of op amps, the power supply pin (VDD for single-supply) should have a local bypass capacitor (i.e., 0.01 F to 0.1 F) within 2 mm for good high-frequency performance. It also needs a bulk capacitor (i.e., 1 F or larger) within 100 mm to provide large, slow currents. This bulk capacitor can be shared with other parts. + MCP60X VOUT - 3.6 PCB Surface Leakage In applications where low input bias current is critical, printed circuit board (PCB) surface leakage effects need to be considered. Surface leakage is caused by humidity, dust or other contamination on the board. Under low humidity conditions, a typical resistance between nearby traces is 1012. A 5V difference would cause 5 pA of current to flow. This is greater than the MCP601/2/3/4 family's bias current at +25C (1 pA, typ.). The easiest way to reduce surface leakage is to use a guard ring around sensitive pins (or traces). The guard ring is biased at the same voltage as the sensitive pin. An example of this type of layout is shown in Figure 3-4. Guard Ring VIN- VIN+ FIGURE 3-5: Sallen-Key Filter. Second-Order, Low-Pass R2 618 k R3 R1 618 k 1.00 M VIN C2 47 nF VDD/2 C1 8.2 nF G = -1 V/V fP = 10 Hz VOUT + MCP60X - FIGURE 3-6: Second-Order, Low-Pass Multiple-Feedback Filter. The MCP601/2/3/4 family of op amps have low input bias current, which allows the designer to select larger resistor values and smaller capacitor values for these filters. This helps produce a compact PCB layout. These filters, and others, can be designed using Microchip's FilterLab(R) software. FIGURE 3-4: Example Guard Ring layout. DS21314F-page 12 2004 Microchip Technology Inc. MCP601/2/3/4 3.7.2 INSTRUMENTATION AMPLIFIER CIRCUITS 3.7.3 PHOTO DETECTION Instrumentation amplifiers have a differential input that subtracts one input voltage from another and rejects common mode signals. These amplifiers also provide a single-ended output voltage. The three-op amp instrumentation amplifier is illustrated in Figure 3-7. One advantage of this approach is unitygain operation, while one disadvantage is that the common mode input range is reduced as R2/RG gets larger. V1 + The MCP601/2/3/4 op amps can be used to easily convert the signal from a sensor that produces an output current (such as a photo diode) into a voltage (a transimpedance amplifier). This is implemented with a single resistor (R2) in the feedback loop of the amplifiers shown in Figure 3-9 and Figure 3-10. The optional capacitor (C2) sometimes provides stability for these circuits. A photodiode configured in the Photovoltaic mode has zero voltage potential placed across it (Figure 3-9). In this mode, the light sensitivity and linearity is maximized, making it best suited for precision applications. The key amplifier specifications for this application are: low input bias current, low noise, common mode input voltage range (including ground) and rail-to-rail output. C2 R2 MCP60X - R3 - R4 MCP60X RG - VOUT R2 R2 R3 + R4 MCP60X V2 + VREF Light ID1 D1 - VDD VOUT 2R 2 R 4 V OU T = ( V 1 - V 2 ) 1 + -------- ----- + V REF R G R 3 MCP60X + VOUT = ID1 R2 FIGURE 3-7: Three-Op Amp Instrumentation Amplifier. The two-op amp instrumentation amplifier is shown in Figure 3-8. While its power consumption is lower than the three-op amp version, its main drawbacks are that the common mode range is reduced with higher gains and it must be configured in gains of two or higher. RG R1 VREF V2 V1 R 1 2R 1 V O UT = ( V 1 - V 2 ) 1 + ----- + -------- + V REF R 2 RG MCP60X + R2 R2 MCP60X + R1 FIGURE 3-9: Photovoltaic Mode Detector. VOUT In contrast, a photodiode that is configured in the Photoconductive mode has a reverse bias voltage across the photo-sensing element (Figure 3-10). This decreases the diode capacitance, which facilitates high-speed operation (e.g., high-speed digital communications). The design trade-off is increased diode leakage current and linearity errors. The op amp needs to have a wide Gain Bandwidth Product (GBWP). C2 R2 ID1 D1 VBIAS - VDD VOUT Light MCP60X + VOUT = I D1 R2 VBIAS < 0V FIGURE 3-8: Two-Op Amp Instrumentation Amplifier. Both instrumentation amplifiers should use a bulk bypass capacitor of at least 1 F. The CMRR of these amplifiers will be set by both the op amp CMRR and resistor matching. FIGURE 3-10: Detector. Photoconductive Mode 2004 Microchip Technology Inc. DS21314F-page 13 MCP601/2/3/4 4.0 DESIGN TOOLS Microchip provides the basic design tools needed for the MCP601/2/3/4 family of op amps. 4.1 SPICE Macro Model The latest SPICE macro model of the MCP601/2/3/4 op amps is available on Microchip's web site at www.microchip.com. This model is intended as an initial design tool that works well in the op amp's linear region of operation at room temperature. See the SPICE model firmware for information on its capabilities. Bench testing is a very important part of any design and cannot be replaced with simulations. Also, simulation results using this macro model need to be validated by comparing them to the data sheet specs and plots. 4.2 FilterLab(R) 2.0 FilterLab(R) 2.0 is an innovative software tool that simplifies analog active-filter (using op amps) design. Available at no cost from Microchip's web site at www.microchip.com, the FilterLab active-filter software design tool provides full schematic diagrams of the filter circuit with component values. It also outputs the filter circuit in SPICE format, which can be used with the macro model to simulate actual filter performance. DS21314F-page 14 2004 Microchip Technology Inc. MCP601/2/3/4 5.0 5.1 PACKAGING INFORMATION Package Marking Information 5-Lead SOT-23 (MCP601 and MCP601R Only) Example: XXNN 04NN 6-Lead SOT-23A (MCP603 Only) Example: XXNN 04NN Legend: XX...X YY WW NNN Customer specific information* Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard OTP marking consists of Microchip part number, year code, week code, and traceability code. 2004 Microchip Technology Inc. DS21314F-page 15 MCP601/2/3/4 Package Marking Information 8-Lead PDIP (300 mil) Example: XXXXXXXX XXXXXNNN YYWW MCP601 I/P256 0424 8-Lead SOIC (150 mil) Example: XXXXXXXX XXXXYYWW NNN MCP601 I/SN0324 256 8-Lead TSSOP Example: XXXX XYWW NNN 601 I324 256 14-Lead PDIP (300 mil) (MCP604 Only) Example: XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN MCP604-I/P XXXXXXXXXXXXXX 0424256 14-Lead SOIC (150 mil) (MCP604 Only) Example: XXXXXXXXXXX XXXXXXXXXXX YYWWNNN MCP604ISL XXXXXXXXXXX 0424256 14-Lead TSSOP (4.4mm) (MCP604 Only) Example: XXXXXXXX YYWW NNN 604I 0324 256 DS21314F-page 16 2004 Microchip Technology Inc. MCP601/2/3/4 5-Lead Plastic Small Outline Transistor (OT) (SOT-23) E E1 p B p1 D n 1 c A A2 L A1 Units Dimension Limits n Number of Pins p Pitch p1 Outside lead pitch (basic) Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic A A2 A1 E E1 D L c B MIN INCHES* NOM 5 .038 .075 .046 .043 .003 .110 .064 .116 .018 5 .006 .017 5 5 MAX MIN .035 .035 .000 .102 .059 .110 .014 0 .004 .014 0 0 .057 .051 .006 .118 .069 .122 .022 10 .008 .020 10 10 MILLIMETERS NOM 5 0.95 1.90 0.90 1.18 0.90 1.10 0.00 0.08 2.60 2.80 1.50 1.63 2.80 2.95 0.35 0.45 0 5 0.09 0.15 0.35 0.43 0 5 0 5 MAX 1.45 1.30 0.15 3.00 1.75 3.10 0.55 10 0.20 0.50 10 10 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-178 Drawing No. C04-091 2004 Microchip Technology Inc. DS21314F-page 17 MCP601/2/3/4 6-Lead Plastic Small Outline Transistor (CH) (SOT-23) E E1 B p1 D n 1 c A L A1 A2 Number of Pins 6 Pitch .038 p1 Outside lead pitch (basic) .075 Overall Height A .035 .046 .057 Molded Package Thickness .035 .043 .051 A2 Standoff .000 .003 .006 A1 Overall Width E .102 .110 .118 Molded Package Width .059 .064 .069 E1 Overall Length D .110 .116 .122 Foot Length L .014 .018 .022 Foot Angle 0 5 10 c Lead Thickness .004 .006 .008 Lead Width B .014 .017 .020 Mold Draft Angle Top 0 5 10 Mold Draft Angle Bottom 0 5 10 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEITA (formerly EIAJ) equivalent: SC-74A Drawing No. C04-120 Units Dimension Limits n p MIN INCHES* NOM MAX MIN MILLIMETERS NOM 6 0.95 1.90 0.90 1.18 0.90 1.10 0.00 0.08 2.60 2.80 1.50 1.63 2.80 2.95 0.35 0.45 0 5 0.09 0.15 0.35 0.43 0 5 0 5 MAX 1.45 1.30 0.15 3.00 1.75 3.10 0.55 10 0.20 0.50 10 10 DS21314F-page 18 2004 Microchip Technology Inc. MCP601/2/3/4 8-Lead Plastic Dual In-line (P) - 300 mil (PDIP) E1 D 2 n 1 E A A2 c L A1 eB B1 p B Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic Units Dimension Limits n p A A2 A1 E E1 D L c B1 B eB MIN INCHES* NOM 8 .100 .155 .130 .313 .250 .373 .130 .012 .058 .018 .370 10 10 MAX MIN .140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310 5 5 .170 .145 .325 .260 .385 .135 .015 .070 .022 .430 15 15 MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MAX 4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 2004 Microchip Technology Inc. DS21314F-page 19 MCP601/2/3/4 8-Lead Plastic Small Outline (SN) - Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 h 45 c A A2 L A1 Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic Units Dimension Limits n p A A2 A1 E E1 D h L c B MIN .053 .052 .004 .228 .146 .189 .010 .019 0 .008 .013 0 0 INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12 MAX MIN .069 .061 .010 .244 .157 .197 .020 .030 8 .010 .020 15 15 MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12 MAX 1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 8 0.25 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 DS21314F-page 20 2004 Microchip Technology Inc. MCP601/2/3/4 8-Lead Plastic Thin Shrink Small Outline (ST) - 4.4 mm (TSSOP) E E1 p 2 1 n B D A c L A1 A2 Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic Units Dimension Limits n p A A2 A1 E E1 D L c B MIN INCHES NOM 8 .026 MAX MIN .033 .002 .246 .169 .114 .020 0 .004 .007 0 0 .035 .004 .251 .173 .118 .024 4 .006 .010 5 5 .043 .037 .006 .256 .177 .122 .028 8 .008 .012 10 10 MILLIMETERS* NOM MAX 8 0.65 1.10 0.85 0.90 0.95 0.05 0.10 0.15 6.25 6.38 6.50 4.30 4.40 4.50 2.90 3.00 3.10 0.50 0.60 0.70 0 4 8 0.09 0.15 0.20 0.19 0.25 0.30 0 5 10 0 5 10 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEDEC Equivalent: MO-153 Drawing No. C04-086 2004 Microchip Technology Inc. DS21314F-page 21 MCP601/2/3/4 14-Lead Plastic Dual In-line (P) - 300 mil (PDIP) E1 D 2 n 1 E A A2 c eB A1 B1 B p L Number of Pins Pitch Top to Seating Plane A .140 .170 Molded Package Thickness A2 .115 .145 Base to Seating Plane A1 .015 Shoulder to Shoulder Width E .300 .313 .325 Molded Package Width E1 .240 .250 .260 Overall Length D .740 .750 .760 Tip to Seating Plane L .125 .130 .135 c Lead Thickness .008 .012 .015 Upper Lead Width B1 .045 .058 .070 Lower Lead Width B .014 .018 .022 Overall Row Spacing eB .310 .370 .430 Mold Draft Angle Top 5 10 15 Mold Draft Angle Bottom 5 10 15 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-005 Units Dimension Limits n p MIN INCHES* NOM 14 .100 .155 .130 MAX MIN MILLIMETERS NOM 14 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 18.80 19.05 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MAX 4.32 3.68 8.26 6.60 19.30 3.43 0.38 1.78 0.56 10.92 15 15 DS21314F-page 22 2004 Microchip Technology Inc. MCP601/2/3/4 14-Lead Plastic Small Outline (SL) - Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 h 45 c A A2 Units Dimension Limits n p A A2 A1 E E1 D h L c B L A1 MIN Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic .053 .052 .004 .228 .150 .337 .010 .016 0 .008 .014 0 0 INCHES* NOM 14 .050 .061 .056 .007 .236 .154 .342 .015 .033 4 .009 .017 12 12 MAX MIN .069 .061 .010 .244 .157 .347 .020 .050 8 .010 .020 15 15 MILLIMETERS NOM 14 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 5.99 3.81 3.90 8.56 8.69 0.25 0.38 0.41 0.84 0 4 0.20 0.23 0.36 0.42 0 12 0 12 MAX 1.75 1.55 0.25 6.20 3.99 8.81 0.51 1.27 8 0.25 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-065 2004 Microchip Technology Inc. DS21314F-page 23 MCP601/2/3/4 14-Lead Plastic Thin Shrink Small Outline (ST) - 4.4 mm (TSSOP) E E1 p D 2 n B 1 A c L A1 A2 Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic Units Dimension Limits n p A A2 A1 E E1 D L c B MIN INCHES NOM 14 .026 .035 .004 .251 .173 .197 .024 4 .006 .010 5 5 MAX MIN .033 .002 .246 .169 .193 .020 0 .004 .007 0 0 .043 .037 .006 .256 .177 .201 .028 8 .008 .012 10 10 MILLIMETERS* NOM MAX 14 0.65 1.10 0.85 0.90 0.95 0.05 0.10 0.15 6.25 6.38 6.50 4.30 4.40 4.50 4.90 5.00 5.10 0.50 0.60 0.70 0 4 8 0.09 0.15 0.20 0.19 0.25 0.30 0 5 10 0 5 10 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEDEC Equivalent: MO-153 Drawing No. C04-087 DS21314F-page 24 2004 Microchip Technology Inc. MCP601/2/3/4 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range MCP601 MCP601T /XX Package Examples: a) b) c) Single Op Amp, Industrial Temperature, 8LD PDIP package. MCP601-E/SN: Single Op Amp, Extended Temperature, 8LD SOIC package. MCP601T-I/OT: Tape and Reel, Industrial Temperature, Single Op Amp, 5-LD SOT23 package. MCP601T-E/ST: Tape and Reel, Extended Temperature, Single Op Amp, 8LD TSSOP package MCP601RT-E/OT: Tape and Reel, Extended Temperature, Single Op Amp, Rotated, 5-LD SOT23 package. MCP602-I/SN: MCP602-E/P: MCP602T-E/ST: Dual Op Amp, Industrial Temperature, 8LD SOIC package. Dual Op Amp, Extended Temperature, 8LD PDIP package. Tape and Reel, Extended Temperature, Dual Op Amp, 8LD TSSOP package. Industrial Temperature, Single Op Amp with Chip Select,8LD SOIC package. Extended Temperature, Single Op Amp with Chip Select, 8LD PDIP package. Tape and Reel, Extended Temperature, Single Op Amp with Chip Select, 8LD TSSOP package. Tape and Reel, Industrial Temperature, Single Op Amp with Chip Select, 8LD SOIC package. Industrial Temperature, Quad Op Amp, 14LD PDIP package. Extended Temperature, Quad Op Amp, 14LD SOIC package. Tape and Reel, Industrial Temperature, Quad Op Amp, 14LD TSSOP package. MCP601-I/P: Device Single Op Amp Single Op Amp (Tape and Reel for SOT23, SOIC and TSSOP) MCP601RT Single Op Amp (Tape and Reel for SOT23-5) MCP602 Dual Op Amp MCP602T Dual Op Amp (Tape and Reel for SOIC and TSSOP) MCP603 Single Op Amp with Chip Select MCP603T Single Op Amp with Chip Select (Tape and Reel for SOT23, SOIC and TSSOP) MCP604 Quad Op Amp MCP604T Quad Op Amp (Tape and Reel for SOIC and TSSOP) I E = -40C to +85C = -40C to +125C d) e) a) b) c) Temperature Range Package OT CH P SN SL ST = = = = = = Plastic SOT23, 5-lead (MCP601 only) Plastic SOT23, 6-lead (MCP603 only) Plastic DIP (300 mil Body), 8, 14-lead Plastic SOIC (150 mil Body), 8-lead Plastic SOIC (150 mil Body), 14-lead Plastic TSSOP (4.4mm Body), 8, 14-lead a) b) c) MCP603-I/SN: MCP603-E/P: MCP603T-E/ST: d) MCP603T-I/SN: a) b) c) MCP604-I/P: MCP604-E/SL: MCP604T-I/ST: Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2004 Microchip Technology Inc. DS21314F-page 25 MCP601/2/3/4 NOTES: DS21314F-page 26 2004 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." * * Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart and rfPIC are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartShunt and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, Select Mode, SmartSensor, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2004, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company's quality system processes and procedures are for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS21314F-page 27 2004 Microchip Technology Inc. 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B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 Detroit Tri-Atria Office Building 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Tel: 248-538-2250 Fax: 248-538-2260 Denmark Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45-4420-9895 Fax: 45-4420-9910 China - Shenzhen Rm. 1812, 18/F, Building A, United Plaza No. 5022 Binhe Road, Futian District Shenzhen 518033, China Tel: 86-755-82901380 Fax: 86-755-8295-1393 Kokomo 2767 S. Albright Road Kokomo, IN 46902 Tel: 765-864-8360 Fax: 765-864-8387 France Parc d'Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 China - Shunde Room 401, Hongjian Building, No. 2 Fengxiangnan Road, Ronggui Town, Shunde District, Foshan City, Guangdong 528303, China Tel: 86-757-28395507 Fax: 86-757-28395571 Los Angeles 18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338 China - Qingdao Rm. B505A, Fullhope Plaza, No. 12 Hong Kong Central Rd. Qingdao 266071, China Tel: 86-532-5027355 Fax: 86-532-5027205 Germany Steinheilstrasse 10 D-85737 Ismaning, Germany Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 San Jose 1300 Terra Bella Avenue Mountain View, CA 94043 Tel: 650-215-1444 Fax: 650-961-0286 India Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O'Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-22290061 Fax: 91-80-22290062 Italy Via Quasimodo, 12 20025 Legnano (MI) Milan, Italy Tel: 39-0331-742611 Fax: 39-0331-466781 Toronto 6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 Japan Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Netherlands P. A. De Biesbosch 14 NL-5152 SC Drunen, Netherlands Tel: 31-416-690399 Fax: 31-416-690340 ASIA/PACIFIC Australia Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 United Kingdom 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44-118-921-5869 Fax: 44-118-921-5820 02/17/04 DS21314F-page 28 2004 Microchip Technology Inc. |
Price & Availability of MCP601-ECH
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